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Think and work like an expert Geological Oceanographer. Use when a task calls for Geological Oceanographer judgment. Reasons from sediment transport mechanics, stratigraphic context, and accommodation through multibeam (EM122/EM712) and sub-bottom/seismic imaging, gravity and piston cores with XRF/X-ray CT, CTD tow-yo ORP/Mn/CH4 plume surveys, and Bouma/Lowe facies analysis, while treating bathymetry-mimicking multipath artifacts, bioturbation homogenizing event beds, glacial isostasy mistaken for eustasy, and single-core turbidite extrapolation as first-class failure modes.

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Think and work like an expert Accelerator Physicist. Use when a task calls for Accelerator Physicist judgment. Reasons from beam optics, RF cavities, emittance budgets, and loss maps while treating halo and impedance-driven instabilities as first-class failure modes.

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Aceternity UI is a collection of animated React components (3D cards, spotlight, background beams, moving borders, wavy backgrounds) built with Tailwind CSS and the motion library, installed into your project as source through the shadcn CLI. Use when someone asks for "animated hero section", "3D tilt card", "spotlight effect", "moving border button", "Aceternity component", or "glowing background" in a React or Next.js app.

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半导体芯片制造工艺 (Semiconductor Process Engineering / 半导体芯片制造工艺 — 以「物理化学极限 + 良率经济双重约束」为特征的集成电路前道/后道制造工艺认知操作系统：从「器件架构与微缩路线（planar→FinFET→GAA nanosheet→CFET、等效微缩 DTCO/STCO、背面供电 BSPDN）→ 工艺整合（FEOL/MOL/BEOL 模块协同、PDK、流片 tape-out）→ 单元工艺（光刻 litho（DUV 浸没式 193i / EUV 13.5nm / 多重曝光 SADP-SAQP / OPC / mask）、刻蚀 etch（RIE/ICP/原子层刻蚀 ALE）、薄膜沉积 depo（CVD/PECVD/LPCVD/ALD/PVD/外延 epi/电镀 Cu）、掺杂 doping（离子注入 ion implant / 退火 RTA-laser anneal）、CMP 化学机械抛光、清洗 cleaning）→ 量测检测 metrology（CD-SEM / OCD / overlay / 椭偏 ellipsometry / 缺陷检测 defect inspection / e-beam）→ 良率工程 yield（缺陷密度 / SPC 统计过程控制 / FDC / APC / DOE 实验设计 / 良率爬坡 yield ramp）→ 先进封装 advanced packaging（2.5D/3D、CoWoS、HBM、混合键合 hybrid bonding、chiplet、TSV）」的完整器件-工艺-良率-量产决策链。覆盖 (a) 第一性张力 — **物理/化学/材料的硬约束（量子隧穿、短沟道效应、RC 延迟、热预算、缺陷物理、ppb 级污染控制）⇄ 良率/成本/产能的经济约束（每片晶圆成本、良率是主经济指标、D0 缺陷密度、wafer-per-hour、折旧）**；**持续微缩/摩尔定律（dimensional + equivalent scaling、节点路线图 N5/N3/N2/A16/A14、high-NA EUV）⇄ 物理极限/微缩放缓（原子尺度、漏电、功耗墙、成本墙、'摩尔定律已死'之争）**；**协同优化/整合（DTCO 设计-工艺协同、STCO 系统-工艺协同、模块间 trade-off）⇄ 单模块极致优化（单一 unit process 工艺窗口）**；**工艺配方的 tacit 手艺（process recipe 调试、工艺窗口、缺陷根因分析、量产 ramp 的经验）⇄ 可建模/可仿真/数据驱动（TCAD 仿真、ML 良率分析、APC/FDC、数字孪生）**；**性能-功耗-面积-成本 PPAC 四角权衡 ⇄ 良率/可制造性 DFM 优先**；**自主可控/国产替代（卡脖子、EUV 出口管制、设备/材料/EDA 国产化、SMIC/长江存储/长鑫/中微/北方华创/上海微电子）⇄ 全球高度分工（ASML 光刻垄断、AMAT/Lam/TEL/KLA 设备、TSMC/Samsung/Intel 代工、全球供应链）**。(b) 核心工作流 / pipeline（最标准、最易蒸高质量 + CLI 化）— 新节点/新工艺导入：器件目标与 PPAC 定义 → 工艺整合方案与 PDK → 单元工艺开发与配方调试（DOE 找工艺窗口）→ 量测建立与 SPC → 良率爬坡（缺陷分类 + 根因分析 + 工艺改善）→ 量产移交与持续改善。具体单元工艺 SOP：光刻（曝光条件 / OPC / overlay 控制 / 多重曝光分解）、刻蚀（选择比 / profile / loading effect / ALE）、沉积（台阶覆盖 / 应力 / 均匀性）、CMP（去除速率 / 碟形 dishing / 侵蚀 erosion）、量测与缺陷分析、良率分析与 FA 失效分析。(c) 工具栈 — 设备（光刻 ASML/上海微电子 SMEE；刻蚀+沉积 AMAT/Lam/TEL/中微 AMEC/北方华创 Naura；离子注入 AMAT/Axcelis；CMP AMAT/荏原 Ebara；量测检测 KLA/AMAT/中科飞测/上海精测）、EDA/TCAD/仿真（Synopsys Sentaurus/Silvaco/Coventor SEMulator3D、OPC Calibre/Synopsys）、良率与制造软件（SPC、MES、FDC/APC、缺陷分析 yield management、PWS）、材料（光刻胶 photoresist、CMP 浆料 slurry、特气、靶材、掩膜 mask blank）。(d) 知识正典 — 半导体工艺 canon 横跨器件物理与制造工程：核心教材（Plummer/Deal/Griffin《Silicon VLSI Technology》、Sze《Physics of Semiconductor Devices》《VLSI Technology》、Wolf & Tauber《Silicon Processing for the VLSI Era》、Campbell《Fabrication Engineering at the Micro and Nanoscale》、May & Spanos《Fundamentals of Semiconductor Manufacturing and Process Control》、Quirk & Serda《Semiconductor Manufacturing Technology》、肖国勇/施敏中文教材）、路线图（ITRS/IRDS、IEEE 国际器件与系统路线图）、顶会论文（IEDM、Symposium on VLSI Technology、IRPS 可靠性、SPIE Advanced Lithography、ISSCC、DAC）、行业分析（SemiAnalysis、TechInsights、IC Knowledge）。(e) figures/流派 — 学术与器件奠基（Gordon Moore 摩尔、Robert Dennard 登纳德微缩、胡正明 Chenming Hu FinFET/UTB-SOI 发明人 UC Berkeley、刘明 Tsu-Jae King Liu Berkeley、Krishna Saraswat Stanford、Mark Bohr Intel 工艺架构）、产业领袖与工艺大师（张忠谋 Morris Chang TSMC、林本坚 Burn-Jeng Lin 浸没式光刻、Martin van den Brink ASML、米玉杰/梁孟松 SMIC/三星工艺、Mark Liu/魏哲家 TSMC）、行业分析师（Dylan Patel SemiAnalysis、Scotten Jones IC Knowledge、TechInsights 拆解、Handel Jones）、科普与拆解（Asianometry、The Chip Letter、半导体行业观察）。流派分歧：等效微缩派 vs 摩尔定律已死派、前道微缩 vs 先进封装 chiplet 异构集成、dimensional scaling vs DTCO 协同优化、IDM vs 纯代工 foundry 模式、自主可控/国产替代路线 vs 全球分工。(f) 行业话术/黑话 — 制程节点 node / 流片 tape-out / 工艺窗口 process window / 良率 yield / 缺陷密度 D0 / 关键尺寸 CD / 套刻 overlay / 掩膜 reticle-mask / 光刻胶 PR / 浸没式 immersion / EUV/DUV / 多重曝光 multi-patterning SADP-SAQP / OPC / 刻蚀选择比 selectivity / profile / loading effect / 原子层刻蚀 ALE / 台阶覆盖 step coverage / 外延 epi / 离子注入 implant / 退火 anneal / RTA / CMP / dishing-erosion / FEOL-MOL-BEOL / FinFET / GAA / 纳米片 nanosheet / CFET / 背面供电 BSPDN / high-NA / PPAC / DTCO-STCO / DFM / SPC / FDC-APC / DOE / WAT-PCM / 良率爬坡 yield ramp / FA 失效分析 / particle 颗粒 / 洁净室 cleanroom-级别 / 12寸-8寸 wafer / chiplet / CoWoS / HBM / 混合键合 hybrid bonding / TSV / PDK / 等效微缩. (g) 争议/批判 — 「摩尔定律是否已死 vs 等效微缩继续」、「节点命名营销化（N3/N2 ≠ 物理 3nm/2nm，gate pitch/metal pitch 才是真尺度）」、「前道微缩 vs 先进封装异构集成谁是未来」、「自主可控/国产替代的现实（EUV 卡脖子、设备/材料/EDA 国产化进度、出口管制 entity list、良率与成熟度差距）」、「良率/成本/性能三角权衡」、「人才稀缺与工艺 know-how 的 tacit 性」、「中国大基金/产能扩张是否过剩」、「制裁与技术封锁」。(h) 大量隐性工艺手艺（process recipe 调试与工艺窗口寻找、缺陷根因分析与 FA、量产良率爬坡的经验判

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Systematic materials selection for engineering design using performance indices, Ashby charts, multi-constraint optimization, and case-based reasoning. Covers the five-step Ashby method — function, objective, constraint, free variable, index — with worked examples for stiffness-limited beams, strength-limited ties, thermally shocked vessels, and minimum-cost components. Use when choosing among metals, polymers, ceramics, and composites under competing objectives.

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Statics, dynamics, stress-strain analysis, materials selection, failure modes, and finite element analysis concepts for engineered structures. Covers free-body diagrams, equilibrium, internal forces (shear and moment), beam deflection, column buckling, material properties, factor of safety, fatigue, fracture mechanics, and FEA workflow. Use when analyzing loads on structures, selecting materials, predicting failure, or interpreting structural behavior.

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Use when the user explicitly asks EZ_math_model to create defense slides, academic presentation slides, Beamer slides, or PPT after the modeling paper has been packaged.

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Use when the user asks to beam, publish, or share the current local coding session to an authenticated remote receiver. Not for viewing a transcript locally: use session-viewer.

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MMDで静止ポーズ、表情、短いモーション、アクセサリ配置を制作・修正する。mmd-mcpによる実機操作、モデル骨格・軸・付与・IKの読み取り専用調査、モデル別の姿勢調整、主要キーと補間の編集、連続プレビューを扱う。

Set up, format, fix, and clean up LaTeX regression and estimation tables in empirical economics or finance papers. Use when (a) creating a .tex, results.tex, main.tex, or preamble to display regression or estimation output from Python (pyfixest), Stata, or R — including any mention of estout, esttab, estauto, estwide, or table fragments; (b) formatting or repairing estout-style regression tables that overflow the right margin, have cramped or boxed notes, misaligned columns, or poor significance stars, or when asked to match a reference paper, make the note fill the table width, or choose among \estwide, \estauto, and landscape layouts; (c) diagnosing "Misplaced \omit" errors from \input-ed table fragments inside tabular environments. Covers \@@input, \estwide, \estauto, \estautoLT, \specialcell, \sym, minipage notes below tabulars, and the convert-and-verify workflow. Do NOT trigger for general LaTeX documents like beamer presentations, problem sets, letters, or CVs.

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Use when building a frontend and the user wants a distinctive / animated / "wow" UI element in React + Tailwind - e.g. a laptop-opening-on-scroll, 3D tilt card, spotlight hero, animated beams/background, marquee, bento grid, interactive globe, meteor/particle background, shimmer button, or scroll/reveal motion. Fetches the showpiece component LIVE at build time from code libraries (Aceternity, Magic UI, Cult UI, ReactBits, 21st.dev) via their shadcn registry command (or WebFetch fallback), then adapts it to brand tokens. Also covers plain components (button, form, modal, table, etc.) as a fallback. Triggers on "make it pop", "something flashy", "animated [X]", "like [cool site]", "build a [showpiece] section". NOT for non-React stacks. Inspiration galleries (Dribbble/godly) are visual reference only - never code.

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When the user wants to cut 1D materials optimally, minimize waste in linear cutting, or solve one-dimensional cutting stock problems. Also use when the user mentions "1D cutting," "linear cutting optimization," "rod cutting," "pipe cutting," "beam cutting," "trim loss," "cutting stock problem," "pattern generation," or "column generation for cutting." For 2D problems, see 2d-cutting-stock. For general trim loss, see trim-loss-minimization.

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Write idiomatic Elixir code with OTP patterns, supervision trees, and Phoenix LiveView. Masters concurrency, fault tolerance, and distributed systems. Use PROACTIVELY for Elixir refactoring, OTP design, or complex BEAM optimizations.

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